A significant cost factor in the particleboard production is the adhesive used. If it is assumed that within the adhesive application the adhesive is distributed proportionally over the surface of the particles, fine particles bind more adhesive relative to their volume than coarse particles. However, the fine particles contribute less to the board structure. Whether a cost advantage can be achieved by screening out the fine fraction before adhesive application was investigated by means of 3D particle measurement. Using ultraviolet microspectrophotometry (UMSP) and digital reflected light microscopy, it was found that the adhesive is almost exclusively on the surface of the particles and that the fine fraction binds a disproportionately large amount of adhesive. This means that the calculated savings tend to underestimate the potential.
More Information:
Article: https://www.mdpi.com/2079-6439/10/11/97/pdf
Thünen Projects:
- Development of a measuring system to determine particle dimensions
- Three-dimensional particle measurement and process integration in particleboard production
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